| Wafer Size | 8 Inch |
| Wafer Thickness | 725±25μm |
| Chip Size | 3.5mm |
| Pad Pitch | 120μm |
| Function | Daisy Chain |
| Pad Config | Peripheral |
| Electrode |
Wire Bonding |
| Pad Size |
115μm×125μm |
| Passivation Opening |
95μm×100μm |
| Scribe Width |
120μm |
| Number of Pad |
96 pads (Outer line) |
| Number of Chip |
2266 chips/wafer |
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