| Wafer Size | 8 inch |
| Wafer Thickness | 725±25μm |
| Chip Size | 12.0mm×10.0mm |
| Pad Pitch | ① 35μm×40μm(I/O area) ② 90μm ×160µm(Staggerd area) ③ 300μm (Outer pad) |
| Function | Daisy Chain |
| Electrode | Electroless Ni/Au plating |
| Pad Size | ① 27μm■ ② 27μm■ ③ 300μm■ |
| Passivation Opening | ① 18μm● ② 18μm● ③ 280μm■ |
| Bump Size | ① 23μm● ② 23μm● ③ 285μm■ |
| Number of Pad |
① 7200 pads(I/O area) |
| Scribe Width | 120μm |
| Number of Chip | 204 chips/wafer |
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