| Specifications | |
| Wafer Size | 8inch |
| Wafer Thickness | 725±25μm |
| Chip Size | 10mm×8mm |
| Function | Daisy Chain |
| Pad Size | 32μm■ |
| Passivation Opening | 7μm (Octagon) |
| Number of Pad | ① 1200 pads ② 714 pads |
| Electrode | Cu Pillar Bump |
| Bump Size | Φ20μm |
| Bump Pitch | ①40μm ②300μm |
| Bump Height | Cu15μm + SnAg8μm |
| Number of Chip | 312 chips/wafer |
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