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Specifications | |
Wafer size | φ300mm |
Wafer Thickness | 775±25um |
Chip size | 25mm * 25 mm (Scribe center to center) |
Pad (bump)pitch | 150μm |
Function | Daisy Chain |
Electrode | Cu pillar (Cu30μm+SnAg15μm) |
Bump size | φ75μm |
Passivation opening | 40μm (octagon) |
Polyimide opening | φ40μm |
Scribe line width | 100μm |
Number of pad | 25,921 pads (161×161 Matrix) |